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Technical Meeting Global Payments Week, 2018
  • DATE:
    December 3–7, 2018, Kuala Lumpur, Malaysia.
  • Deadline registration date:
    October 26, 2018
  • CO-SPONSORS:
    CEMLA, The World Bank Group (WBG), the Bank for International Settlements (BIS) and the Bank Negara Malaysia.
  • CONTENT:
    XXII Meeting of the Working Group on Payment System Issues of Latin America and the Caribbean. Retail payments. Financial inclusion. Fintech. Remittances. Cross-border payments. Foreign exchange settlement. Cyber security.
  • Objective:
    Bring together Payments Forum members to assess project progress, discuss the most important issues and trends in the field of payments and securities settlement, and agree upon next steps. Additionally, to get updates on the latest developments on a global and regional level, networking, and exchange experiences with other national and regional authorities.
  • AIMED AT:
    Latin American and Caribbean national financial authorities and members of the International Advisory Council of the Payments Forum that are responsible for the regulation, operation, oversight and development of payments and market infrastructures.
  • LANGUAGE:
    English with simultaneous interpretation to Spanish.
  • COORDINATOR:
    Raúl Morales.
    Financial Markets and Infrastructure Manager
    Phone: +52 (55) 5061-6676
    Email: mmorales@cemla.org

 

 

 

 

 

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